Adding PIO-Dev-Lite files. #1930
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WalkthroughSeveral new Gerber files have been added to the Changes
Sequence Diagram(s)sequenceDiagram
participant User
participant PCB_Fabricator
User->>PCB_Fabricator: Submit Gerber and drill files (profile, soldermask, solderpaste, drill)
PCB_Fabricator->>PCB_Fabricator: Interpret files for board outline, hole drilling, mask, and paste layers
PCB_Fabricator-->>User: Manufacture and deliver PIO-Dev-Lite PCB as specified
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Actionable comments posted: 0
🧹 Nitpick comments (1)
hardware/README.md (1)
17-17: Typographical refinement: hyphenate “ultra-fast.”
According to compound adjective rules, use “ultra-fast communication” (with a hyphen).🧰 Tools
🪛 LanguageTool
[misspelling] ~17-~17: This expression is normally spelled as one or with a hyphen.
Context: ... featuring FT232H chips can be used for ultra fast communication between the PlayStation 1...(EN_COMPOUNDS_ULTRA_FAST)
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Knowledge Base: Disabled due to data retention organization setting
⛔ Files ignored due to path filters (2)
hardware/PIO-Dev-Lite/PIO-Dev-Lite-assembly.csvis excluded by!**/*.csvhardware/PIO-Dev-Lite/PIO-Dev-Lite-bom.csvis excluded by!**/*.csv
📒 Files selected for processing (7)
hardware/PIO-Dev-Lite/GerberFiles/drill_1_16.xln(1 hunks)hardware/PIO-Dev-Lite/GerberFiles/profile.gbr(1 hunks)hardware/PIO-Dev-Lite/GerberFiles/soldermask_bottom.gbr(1 hunks)hardware/PIO-Dev-Lite/GerberFiles/soldermask_top.gbr(1 hunks)hardware/PIO-Dev-Lite/GerberFiles/solderpaste_bottom.gbr(1 hunks)hardware/PIO-Dev-Lite/GerberFiles/solderpaste_top.gbr(1 hunks)hardware/README.md(1 hunks)
🧰 Additional context used
🪛 LanguageTool
hardware/README.md
[misspelling] ~17-~17: This expression is normally spelled as one or with a hyphen.
Context: ... featuring FT232H chips can be used for ultra fast communication between the PlayStation 1...
(EN_COMPOUNDS_ULTRA_FAST)
⏰ Context from checks skipped due to timeout of 90000ms (9)
- GitHub Check: pcsx-redux (aarch64-linux)
- GitHub Check: pcsx-redux (x86_64-linux)
- GitHub Check: aur-build
- GitHub Check: toolchain
- GitHub Check: cross-arm64
- GitHub Check: coverage
- GitHub Check: macos-build-and-test-toolchain
- GitHub Check: asan
- GitHub Check: build
🔇 Additional comments (7)
hardware/PIO-Dev-Lite/GerberFiles/solderpaste_bottom.gbr (1)
1-13: No review needed for manufacturing data file.
This Gerber file is purely fabrication data (solder paste stencil for bottom layer) and does not contain executable logic.hardware/PIO-Dev-Lite/GerberFiles/drill_1_16.xln (1)
1-189: No review needed for manufacturing data file.
This Excellon drill file defines drill tools and coordinates; it does not involve code logic or formatting concerns.hardware/PIO-Dev-Lite/GerberFiles/soldermask_bottom.gbr (1)
1-126: No review needed for manufacturing data file.
This is the solder mask bottom layer in Gerber format—purely manufacturing instructions.hardware/PIO-Dev-Lite/GerberFiles/profile.gbr (1)
1-953: No review needed for manufacturing data file.
Gerber profile outlines for the PCB are provided; there’s no executable code to validate here.hardware/README.md (1)
13-14: Board entry looks good.
The new PIO-Dev-Lite section accurately describes the board and links to the folder.hardware/PIO-Dev-Lite/GerberFiles/soldermask_top.gbr (1)
1-701: Gerber file format appears valid and well-structured.This file correctly defines the solder mask top layer for the PIO-Dev-Lite board using the RS-274X Gerber format. It includes all necessary elements:
- Proper header declarations (format, units in mm)
- Well-defined apertures for different pad shapes/sizes
- Correctly formatted draw/flash commands for pad placements
- Properly formed polygon regions using G36/G37 commands
- Valid end-of-file marker (M02*)
The file appears to be machine-generated (likely from EAGLE as indicated in the header) and follows standard Gerber format conventions.
hardware/PIO-Dev-Lite/GerberFiles/solderpaste_top.gbr (1)
1-2741: Gerber file format appears valid with correct solder paste specifications.This file properly defines the solder paste top layer for the PIO-Dev-Lite board:
- Format specifications and units are correctly defined in the header
- Aperture definitions use appropriate dimensions for surface mount pads
- Complex polygon regions are well-formed with G36/G37 commands
- Coordinate system and draw/flash commands appear consistent
- File includes proper termination with M02*
The extensive polygon definitions (lines 33-1868) appear to be defining custom paste regions for BGA or QFP packages, which is standard practice for ensuring proper paste volume.
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