This repository contains design files and technical documentation for the webscreen enclosure. The enclosure has been designed to provide a robust and functional solution, optimizing hardware integration with an improved fastening system using insertion and friction instead of adhesives.
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Optimized Design: Fastening via insertion and friction for greater stability and easy assembly.
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Compatibility: Specifically designed for the webscreen with a custom support base.
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Recommended Materials:
PLA,ABS, depending on mechanical and thermal resistance requirements. -
Source Files: Models in Freecad format.
• /Documentation - Contains the technical manual with specifications and assembly guides..
• /STL_Files - contains design files in .STL formats for 3D printing.
• /Editable_files_in_Freecad - contains design files in .FCStd formats for 3D edition in Freecad.
• Watch the assembly instructions video.
• You can also find a detailed guide to fix the webscreen.
To ensure optimal quality and functionality, please follow these printing settings:
• Layer height: 0.2 mm
• Infill density: 20%
• Infill pattern: Gyroid or Grid (for strength and flexibility)
• Wall thickness: 1.2 mm (at least 3 perimeters)
• Top/bottom layers: 4
• Printing material: PLA, PETG, or ABS (PETG recommended for better durability)
• Nozzle diameter: 0.4 mm
• Print speed: 50-60 mm/s
• Supports: Only if necessary (use tree supports for easy removal)
• Bed adhesion: Brim or Raft if necessary (for better grip)
• Cooling fan: 100% (except for the first few layers)
• Temperature Nozzle: 200-220°C (depending on material)
• Temperature Bed: 60°C for PLA, 80°C for PETG, 100°C for ABS
Make sure your print bed is well-leveled, and the first layer adheres properly to avoid warping. If using ABS, print in an enclosed chamber to prevent warping and cracking. For best results, post-processing such as light sanding or acetone smoothing (for ABS) can be applied.
This project is open source. See the LICENSE file for details.
For inquiries or contributions, please contact the development team through the repository issues or via email.
