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ENERGIS - The Managed PDU Project for 10-Inch Rack

Development Status

Overview

The 10-Inch Rack PDU (Power Distribution Unit) is a modular power management system designed for efficient control and monitoring of power in a rack-mounted environment. The project includes a Main Board and a display board to handle switching and power management.

Update 05.2025: Since lot of people said, it would be nice to have a Non-230V-Version, I started to develop the USB-C version of ENERGIS with USB PD Source functionality: PDNode-600 Pro

Hardware Development Phases

Phase Status
PCB Design for Rev1.0 Completed
Enclosure Design Completed
Order PCB Completed
Prototyping and Hardware Testing Completed
Implementing Rev2.0 Completed
Implementing Relay Board Rev2.1 Completed
Initial Firmware Development In Progress
Final PCB Revision In Progress
Enclosure Testing & Ventilation Completed
Power Monitoring Completed
Production Optimization Planned

Changelog:

Rev1.0:

  • Initial desing

Rev2.0:

  • Correct all hardware related bugs
  • Display-Board Rev2.0:
    • Buttons too close to each-other. Manual control is uncomfortable
    • MCP23S17 seems like unreachable, invertory shortage everywhere. Change to MCP23017
  • Controller-Board Rev2.0:
    • W5500 crystal wiring bug.
    • v1.0 connectors replaced to smaller FFC ones
  • Relay-Board Rev2.0:
    • Add HLW8032 for power monitoring
    • Replace Flyback converter to a cheaper - ready made AC-DC converter unit

Rev2.1:

  • Relay-Board Rev2.1:
    • Capacitive dropper does not have enough power to supply 8xHLW8032 - Non-Isolated buck converter implemented
  • Display-Board Rev2.1:
    • Planned revision without the LCD. This is the main size issue, going to do a version where the setup fits in 1U size. Currently for debug purposes 1.5U is perfectly fine

ENERGIS 1.0.0 Final revision

  • Relay-Board and Controller Board is now combined: Main Board
  • Added FT232 to separate CDC/UART
  • Added 2:1 USB MUX
  • Added enable functionality to the PSU
  • Added high precision LDO to supply the MCU

Firmware Development Phases

Phase Status
CONFIG file for HW description Completed
ILI4988 TFT LCD Driver Completed
MCP23017 Display-Board Driver Completed
MCP23017 Relay-Board Driver Completed
W5500 Ethernet Driver Completed
CAT24C512 512K EEPROM Driver Completed
Version Control and EEPROM Data Completed
Display Functions Completed
System Startup Script Completed
Multicore processing and RTOS Completed
Pushbutton control Completed
HLW8032 Power Monitor Dirver Not Started
Make Everything work together In Progress
HTML Server Implementation In Progress
Software debugging In Progress
Ethernet based firmware update Planned

PDU 3D View

PDU 3D View

Features

  • Main Board: Handles Ethernet communication, power conversion, and system logic. Manages AC switching with 8x 230V relays and safety isolation.
  • Display Board:
    • 1U version: Headless mode, possible manual control with push buttons and real-time LED feedback
    • 1.5U version: Provides user interaction with TFT display and push buttons.
  • Ethernet Connectivity: Uses the W5500 SPI-based Ethernet chip for remote control and monitoring via SNMPv1 and/or Web-UI
  • Power Measurement: AC voltage and current sensing for monitoring.
  • 3D Printed Enclosure: Designed for 10-inch rack mounting with front and rear access.

Specifications

Electrical Characteristics

  • Input: 230V AC, 15A max
  • Output: 230V AC, 15A/Active Channels - Amps per Channel
  • Internal Power Supply: 12V, 1.5A SMPS
  • Derived Voltages: 5V and 3.3V regulated from 12V
  • Relay Supply: 12V dedicated for relay operation

Relay Output Ratings

  • Common AC Trace Handling: 15A max
  • Per-Relay Trace Rating: 16A max
  • Relay Contact Rating: 16A max

Control & Driving Circuit

  • Relay Driver: ULN2803 Darlington Array
  • Driving Current: 33mA per relay
  • Current Limit Resistor: Configured for 35mA max per relay coil

Hardware Stackup

Main Board 3D View Display Board 3D View

JLC06161H-3313 (Finished Thickness: ~1.54 mm ±10 %) (6 layers – standard settings)

  • Total Layers: 6
  • Finished Thickness: ~1.54 mm (±10 %)
  • Outer Copper Weight: 1 oz
  • Inner Copper Weight: 0.5 oz
  • Prepreg & Core Materials: FR4 (JLC06161H-3313)

Layer Stackup

Layer Material Thickness (mm)
L1 (SIG) Outer Copper Weight 1 oz 0.0350
Prepreg 3313 RC57 % 4.2 mil 0.0994
L2 (GND) Inner Copper Weight 0.5 oz 0.0152
Core 0.55 mm H (without copper) 0.5500
L3 (PWR) Inner Copper Weight 0.5 oz 0.0152
Prepreg 2116 RC54 % 4.9 mil 0.1088
L4 (SIG) Inner Copper Weight 0.5 oz 0.0152

Impedance Control

Impedance (Ω) Type Signal Top Ref Bottom Ref Trace Width (mm) Trace Spacing (mm)
50 Coplanar Single Ended L1 / L2 0.2000 /
90 Coplanar Differential Pair L1 / L2 0.1549 0.1905
100 Coplanar Differential Pair L1 / L2 0.1209 0.1905
100 Coplanar Differential Pair L6 L5 / 0.1209 0.1905
90 Coplanar Differential Pair L6 L5 / 0.1549 0.1905
50 Coplanar Single Ended L6 L5 / 0.2000 /

Schematics

The full schematics for each board are available:

License

This project is licensed under the GPL-3.0 License. See the LICENSE file for details.

Contact

For questions or feedback:

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8CH PDU for 10 Inch Racks

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