Optimal microstrip lumped port size/placement and Thirds Rule question. #200
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Answering my own question. I did a lot of tests using 50 Ohm line and came up to a conclusion that first case placement is enough. I found out that unwanted variation in impedance was caused by the automatically generated mesh and not by the port itself. I excluded port from DetectEdges() function: |
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FDTD Mesh page of OpenEMS wiki mentions Thirds Rule: "...to put a mesh line 1/3 inside and 2/3 outside the metal." From my understanding, the thirds rule is especially important for sparse FDTD grid (low resolution grid). Image above shows four arrangements:
1 - "standard" placement. This is what we usually see in commercial simulators. Note that port width is not aligned with vertical mesh lines. I don't know if this a problem, but port will not work if it is not aligned with horizontal mesh line.
2 - Horizontal mesh line and lumped port are placed 1/3 * max_res from microstrip edge. Lumped port thickness is 2 * 3 * max_res.
3 - The same as (2), but port width is decreased to be aligned with "1/3" rule mesh lines
4 - The same as (1), but horizontal mesh line and port are placed 1/3 * max_res away from microstrip edge
I know that using 1/3 rule doesn't make much sense on a port (vertical direction), it's just to make grid and placement more uniform.
My question is about port width. Should it be aligned with mesh lines or with metal width? I use OpenEMS for my educational project and want to use best approach in my examples. Most likely case 1 is the best option if mesh is dense enough. Are there any know-hows on port placement, especially for sparse mesh?
Case 1:
Case 2:
Case 3:
Case 4:
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