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1 |
| -## Disclaimer |
| 1 | +# Test Plan |
| 2 | + |
| 3 | +```{admonition} Disclaimer |
2 | 4 | Please note that this module is currently under development and may contain partially implemented features, therefore it is not supported in the current release.
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| 5 | +``` |
3 | 6 |
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4 |
| -## Test plan and architecture overview |
| 7 | +## Overview |
5 | 8 | To ensure the whole stack is working as expected and track bugs, a layer based test architecture is needed on OCP. This plan consists of four layers. The first and second layers mentioned below, would be a part of the future automation testing framework on each OCP (x,y,z) release.
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6 | 9 |
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7 |
| -#### L1 First Layer: Host OS and Driver Interfaces |
8 |
| -Layer 1 test cases should be executed before deploying [Intel Device Plugins Operator](/device_plugins/README.md) and after deploying OOT drivers like [Intel Data Center GPU Driver on OpenShift](/kmmo/README.md#managing-intel-dgpu-driver-with-kmm-operator). It includes test cases : |
| 10 | +### L1 First Layer: Host OS and Driver Interfaces |
| 11 | +Layer 1 test cases should be executed before deploying [Intel Device Plugins Operator](/device_plugins/README.md) and after deploying OOT drivers like [Intel Data Center GPU Driver on OpenShift](/kmmo/README.md). It includes test cases : |
9 | 12 | * to check existence of in-tree and OOT tree drivers
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10 | 13 | * for SELinux and host OS security
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11 | 14 | * check for devices on all nodes
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12 | 15 |
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13 |
| -#### L2 Second Layer: Device plugin resource provisioning |
| 16 | +### L2 Second Layer: Device Plugin Resource Provisioning |
14 | 17 | L2 test cases are executed after deploying the [Intel Device Plugins Operator](/device_plugins/README.md). Refer to [readme](l2/README.md). It includes:
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15 | 18 | * Pod's resource allocation and scheduling
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16 | 19 | * Simple workloads
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17 | 20 | * Boundary testing for the resources
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18 | 21 | * Future plan for any failure analysis needed during automation.
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19 | 22 |
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20 |
| -#### L3 Third Layer: E2E solution |
21 |
| -L3 test cases are executed after the specific device plugin related e2e solution has been deployed in [day 2](/README.md#day-2---ocp-platform-is-installed-and-ready-to-begin-providing-services). Please refer to [L3 test cases](l3/README.md) for detail. |
| 23 | +### L3 Third Layer: E2E solution |
| 24 | +L3 test cases are executed after the specific device plugin related [e2e solution](/e2e) has been deployed. Please refer to [L3 test cases](l3/README.md) for detail. |
22 | 25 |
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23 |
| -#### L4 Fourth Layer: Reference Workloads |
| 26 | +### L4 Fourth Layer: Reference Workloads |
24 | 27 | This layer includes the reference final application/usecase for the user. It integrates the whole stack and is custom for each Intel hardware feature and device plugin. This layer is yet to be added in upcoming releases.
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