tests: Update Readme

Signed-off-by: vbedida79 <veenadhari.bedida@intel.com>

Author: vbedida79

tests/README.md

@@ -2,20 +2,20 @@
 To ensure the whole stack is working as expected and track bugs, a layer based test architecture is needed on OCP. This plan consists of four layers. The first and second layers mentioned below, would be a part of the future automation testing framework on each OCP (x,y,z) release.
 
 #### L1 First Layer: Host OS and Driver Interfaces 
-Layer 1 test cases should be executed before deploying [Intel Device Plugins Operator](device_plugins/README.md) and after deploying OOT drivers like [Intel Data Center GPU Driver on OpenShift](https://github.com/intel/intel-data-center-gpu-driver-for-openshift/blob/main/README.md). It includes test cases :
+Layer 1 test cases should be executed before deploying [Intel Device Plugins Operator](/device_plugins/README.md) and after deploying OOT drivers like [Intel Data Center GPU Driver on OpenShift](/kmmo/README.md#managing-intel-dgpu-driver-with-kmm-operator). It includes test cases :
 * to check existence of in-tree and OOT tree drivers
 * for SELinux and host OS security
 * check for devices on all nodes
 
 #### L2 Second Layer: Device plugin resource provisioning  
-L2 test cases are executed after deploying the [Intel Device Plugins Operator](device_plugins/README.md). Refer to [readme](l2/README.md). It includes: 
+L2 test cases are executed after deploying the [Intel Device Plugins Operator](/device_plugins/README.md). Refer to [readme](l2/README.md). It includes: 
 * Pod's resource allocation and scheduling 
 * Simple workloads 
 * Boundary testing for the resources
 * Future plan for any failure analysis needed during automation. 
 
 #### L3 Third Layer: E2E solution
-L3 test cases are executed after the specific device plugin related e2e solution has been deployed in [day 2](README.md#day-2---ocp-platform-is-installed-and-ready-to-begin-providing-services). Please refer to [L3 test cases](l3/README.md) for detail.
+L3 test cases are executed after the specific device plugin related e2e solution has been deployed in [day 2](/README.md#day-2---ocp-platform-is-installed-and-ready-to-begin-providing-services). Please refer to [L3 test cases](l3/README.md) for detail.
 
 #### L4 Fourth Layer: Reference Workloads
 This layer includes the reference final application/usecase for the user. It integrates the whole stack and is custom for each Intel hardware feature and device plugin. This layer is yet to be added in upcoming releases.